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T-2500 Precision Temperature Forcing Systems The T-2500 series of precision temperature forcing systems set a higher standard for performance and value than other available systems. High Productivity The wide temperature range of -90C to 225C, in conjunction with the
rapid transition rate, can quickly and accurately bring devices to test
temperature. LN2 injection systems, such as the T-2500IX/M,
can further increase productivity when testing large devices at extreme
low temperatures by extending the lower temperature limit to -130C.
Intelligent Touch-Screen Interface An intelligently designed, multi-color touch-screen makes the system easy to set up and operate. On-screen graphics present the temperature setpoint, air temperature, DUT (device under test) temperature, airflow rate, and current system status. Menus enable the operator to change parameters by touching the desired selections. In addition, a password protection feature makes it possible for the test engineer to determine operator accessibility to essential software segments. Logged data can be stored on diskette. |
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Sophisticated Temperature Cycling Complex temperature profiles are easily set up on the touch screen. Temperature profiles can be saved and recalled for use or exported to 3.5" diskette. Data entered can be as simple as two temperatures and soak times, or as complex as a 99-step cycle - each with a unique temperature, soak time, or ramp rate. T-2500 products may be used for temperature cycling per MIL STD-883C for thermal stressing of semiconductor devices. Precise Temperature Control A patented, proprietary temperature control algorithm provides the most accelerated and precise temperature control of any available temperature forcing system. Physical integration to the DUT is accomplished with the interface kit, which includes thermal caps and a shroud assembly. Coupled with the system's high airflow - and cold boost feature, test temperatures are achieved efficiently and economically; making the T-2500 product series the optimal system(s) for testing semiconductor packages, hybrids, modules, MCMs, PCBs, and small subassemblies. Examples of typical semiconductor packages that the system can accommodate include PLCC, DIP, LCC, PGA, SOP, QFP, and others. Custom thermal fixtures are available to provide a controlled temperature environment for testing larger modules. The case temperature of the DUT can be determined with the use of the DUT sensor (K-type or T-type). This feature makes it possible to control the temperature of the DUT to within ±1C of the desired temperature setpoint. In addition, an advanced temperature control algorithm and self-learn feature assure the DUT is stabilized at temperature quickly. Full ATE Compatibility Remote operation of the system is accomplished with RS-232C and IEEE-488.2 interfaces. A library of remote communication commands enable easy configuration, monitoring, and actuation of critical setup and operating parameters; such as temperature set points and soak times; from any remote computer or terminal. A standard ATE interface providing start test, end of test, and class signals is provided to assure full ATE compatibility which includes the ability to communicate with all main ATE and Rack and Stack test systems. Easy PM and Calibration Thermonics' Precision Temperature Forcing Systems are field proven for durability, performance and reliability. The system can be relied upon for use in around-the-clock production environments. Maximum up time is achieved with a modular design that promotes quick and easy implementation of preventive maintenance activities. Calibration of the system is facilitated by a series of software screens that guide you through the procedure in a systematic manner. In addition, diagnostics screens that report system malfunctions in an easy to understand format assist with servicing of the system. Integrated Thermal Test Head and Motorized Arm Provides a strong support for adapting the thermal test head to the DUT. The positive action, quick adjust arm has several degrees of freedom that enable it to be positioned in a wide range of horizontal and vertical positions. The combination of electro-mechanical and pneumatic action of this assembly ensures precise, stable and repeatable placement of the thermal fixture over the DUT. Heated purge air is provided to keep the test interface free of frost or moisture when operating at cold temperatures. Ambient purge air prevents overheating of test electronics when testing at hot temperatures. |
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